Computation & Electronics
The intelligence layer: sensing, embedded computing, control, and secure communication developed together, in service of real-world physical systems.
Computation, Electronics and Communication Systems
§ R4.01Scope
What this division works on.
Embedded systems
Low-power, field-deployable compute; hard-real-time control; verified firmware.
Industrial cybersecurity
Post-quantum resilient architectures for industrial control and critical infrastructure.
AI for physical systems
Models trained and validated against physical process data, not general corpora.
Distributed control
Coordination and consensus across heterogeneous, unreliable field networks.
§ R4.02Research Programs
Active research programs.
Each program carries a Technology Readiness Level — TRL 1 for foundational research, TRL 9 for systems proven in operation. Research programs are evaluated on knowledge produced, not on revenue.
R4-01
Field-hardened compute stack
A reference stack from silicon to application layer for deployable industrial compute in harsh environments.
TRL 04 /09
BASIC APPLIED DEPLOY
R4-02
Physical-model-grounded AI
Training protocols that bind learned models to physical constraints by construction, not by regularisation.
TRL 03 /09
BASIC APPLIED DEPLOY
R4-03
PQ-resilient industrial networking
Industrial protocol stacks engineered for post-quantum cryptography, with backward interoperability.
TRL 02 /09
BASIC APPLIED DEPLOY